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1
BFP460
Base current. I. B. 5. Total power dissipation. 2). T. S. ? 100°C .... T. = ?(I.
C. ) f = 1 GHz. V. CE. = parameter in V. 0. 10
Relevancy: 100% - - Updated: 18.08.2008
2
Press-Fit Technology, a Solderless Method for Mounting Power Modules
into parts shown in figure 10. Black circles in the base material with higher T
100 %. *) measurement according DIN standards
Relevancy: 58% - - Updated: 18.08.2008
3
B7HF200
Double poly Si self aligned emitter/base. ?. SiGe: C base T. V. early.
? -6.5 V. ? -10 V. 3.5 GHz 150 W/sq ±10%. Poly Resistor 2 p
Relevancy: 57% - - Updated: 18.08.2008
4
Customer Premises Equipment
Two integrated 10/100 Base-T Ethernet MACs. and PHYs for LAN and PC connection.
Two 400 MHz MIPS 24KEc CPUs. (for voice and data handling)
Relevancy: 44% - - Updated: 18.08.2008
5
Further Improvements in the Reliability of IGBT Modules
base plate compared to the total thermal resistance of the The 10 pC at 6 kV
target was reached in September 1996. t (min)
Relevancy: 43% - - Updated: 18.08.2008
6
BC817SU
5 V, f = 100 MHz. f. T. -. 170. -. MHz. Collector-base capacitance. f = 1 MHz, V.
BE. = 10 V. C. cb. -. 3. -. pF. Emitter-base capacitance
Relevancy: 43% - - Updated: 18.08.2008

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